MJ BGA Reballing Solder Stencil Plant Tin Net for MTK CPU OPTION:MT-2 Put the sillica gel on
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MJ BGA Reballing Solder Stencil Plant Tin Net for MTK CPU OPTION:MT-2 Put the sillica gel onPRODUCT INTRODUCTIONType: Hand Tool PartsOrigin: CN(Origin)is_customized: NoMaterial: Aluminium copper AlloyUsage: Commercial Manufacture PRODUCT FEATURES* Stepped groove design enables stencil to align with the tinning position of ic rapidly.* The square holes design makes it easier to take out the formed solder balls.* The high success rate of planting tin, the solder balls can be formed once after you are proficient.
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